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CT scan for data centres

Applications

Data centres.

Solder joints and liquid cooling.

Inspection tasks

Hardware that must not fail.

Servers run dense boards, liquid cooling and backup batteries around the clock. X-ray and CT check all three before they go into the rack.

Boards and processors

BGA joints under large processors and accelerators are checked for voids, bridges and head-in-pillow defects.

Liquid cooling

Cold plates, manifolds and quick connectors are checked for blocked channels, brazing porosity and leak paths.

Backup batteries

Cells and modules for backup power are inspected for electrode alignment, weld defects and foreign particles.

Scan examples

What the data shows.

3D CT rendering of a populated circuit board
Populated board, 3D CT rendering: BGAs and components in one volume.
Two CT slices of a battery cell showing tab foils and electrode stack
Battery cell, two CT slices: tab foils and electrode stack under the cover.
CT slice of a cold plate with the fin area marked
Cold plate, CT slice: fin area marked for evaluation.

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